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RE01-LF

FR4 1.50 mm single-sided 35 µm Cu; without holes

RE01-LFDS

FR4 1.50 mm double-sided 35 µm Cu; without holes

RE010-HP

FR2 1,50 mm without Cu; spacing 2.54 x 2.54 mm

RE012-LF

Prototyping Board FR4 HM 1.27 mm 38.10 x 39.37 mm

RE013-LF

Prototyping Board FR4 HM 1.27 mm 68.58 x 70.84 mm

RE014-LF

Prototyping Board FR4 HM 1.27 mm 99.06 x 99.69 mm

RE015-LF

Prototyping Board FR4 HM 2.54 mm 40.00 x 40.50 mm

RE016-LF

Prototyping Board FR4 HM 2.54 mm 67.94 x 68.58 mm

RE017-LF

Prototyping Board FR4 HM 2.54 mm 100.97 x 99.06 mm

RE060-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612

RE060-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32, 64, 96-channel DIN 41612

RE100-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø

RE100-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 37 x 62 soldering pads 2.20 mm Ø

RE1010

12 self-adhesive strips in pitch 2.54 mm

RE1020

12 self-adhesive strips in pitch 1.27 mm

RE1030

12 self-adhesive strips in pitch 1. 00 mm

RE1040

12 self-adhesive strips in pitch 0.80 mm

RE1050

12 self-adhesive strips in pitch 0. 65 mm

RE1060

12 self-adhesive strips in pitch 0. 635 mm

RE1070

12 self-adhesive strips in pitch 0.50 mm

RE1080

12 self-adhesive strips in pitch 0.40 mm

RE120-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617

RE120-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; connector 31-channel DIN 41617

RE1210-LF

12 self-adhesive strips with staggered square and rectangle pads

RE1220-LF

12 self-adhesive strips with square-pads in parallel order

RE1230-LF

17 self-adhesive strips with potential strips

RE1240-LF

14 self-adhesive strips with quadro-pads

RE1250-LF

12 self-adhesive strips with rectangle pads in parallel order

RE130-LF

Metriclab Card; FR4 1.50 mm single-sided 35 µm Cu; 90.17 x 95.89 mm; spacing 2.00 x 2.00 mm

RE1310-LF

5 self-adhesive SM8-Adapters

RE1320-LF

5 self-adhesive SM14-Adapters

RE1330-LF

5 self-adhesive SM16-Adapters

RE1340-LF

10 self-adhesive SO8-Adapters

RE1350-LF

10 self-adhesive SO14-Adapters

RE1360-LF

10 self-adhesive SO16-Adapters

RE1370-LF

10 self-adhesive DIL8-Adapters

RE1380-LF

10 self-adhesive DIL14-Adapters

RE1390-LF

10 self-adhesive DIL16-Adapters

RE1510-LF

13 self-adhesive SOT323-Adapters

RE1520-LF

10 self-adhesive MSOP8- & MSOP16-Adapters

RE200-C3

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

RE200-DSPT

FR4 1.50 mm double-sided 35 µm Cu (plated through holes); Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

RE200-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

RE200-HT

P97 1.50 mm; single-sided 35 µm Cu; chem. Au; up to 260˚ centigrade

RE200-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

RE200-LFDS

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads

RE201-LFDS

HF-Board; FR4 1.50 mm double-sided 35 µm Cu; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE2011-LF

FR4 1.50 mm without Cu; spacing 2.54mm

RE210-S1

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 x 61 soldering pads 2.20 x 2.20 mm

RE210-S2

CEM3 1.50 mm single-sided 35 µm Cu; size 100 x 220 mm; spacing 2.54 x 2.54 mm; 38 x 85 soldering pads 2.20 x 2.20 mm

RE210-S3

CEM3 1.50 mm single-sided 35 µm Cu; size 100 x 580 mm; spacing 2.54 x 2.54 mm

RE212-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

RE212-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

RE212-LFDS

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; horizontal and vertical conductor paths

RE220-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

RE220-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

RE220-LFDS

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 31-channel DIN 41617

RE224-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652

RE224-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; Europeformat 100 x 160 mm; connector D-Sub DIN 41652

RE225-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652

RE225-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub DIN 41652

RE226-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector D-Sub 2 x 37-channel DIN 41652

RE230-LF

FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; square soldering pads

RE231-LF

HF-Board; FR4 1.50 mm double-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm

RE232-LF

FR4 1.50 mm single-sided 35 µm Cu; 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm; 4 rows DIP IC grid 7.62 mm

RE233-LF

FR4 1.50 mm double-sided 35 µm Cu (plated through); 114.30 x 165.10 mm; spacing 2.54 x 2.54 mm

RE240-LF

FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; 61 x 87 soldering pads

RE3001-LF

Eurocard for Arduino applications

RE3020-LF

Eurocard for Raspberry Pi applications

RE3031-DSPT

Raspberry Pi accessory kit for a UART to USB converter board

RE3032-DSPT

Raspberry Pi accessory kit for an analogue to digital converter board

RE310-S1

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 3-hole-pads

RE310-S2

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 220 mm; spacing 2.54 x 2.54 mm; 3-hole-pads

RE310-S3

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 580mm; spacing 2.54 x 2.54 mm; 3-hole-pads

RE315-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612

RE315-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/65/96-channel DIN 41612

RE317-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel, DIN 41612

RE317-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32-channel DIN 41612

RE318-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

RE318-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

RE319-HP

FR2 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

RE319-LF

FR4 1.50 mm single-sided 35 µm; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 64-channel DIN 41612

RE320-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE320-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE320-LFDS

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE321-LF

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE322-LF

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE323-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612

RE323-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; connector 32-channel/D, 48-channel/E, 48-channel/F DIN 41612

RE330-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 2 x connector 32/64/96-channel DIN 41612

RE331-LF

Multibus II Board; FR4 1.50 mm single-sided 35 µm Cu; 100 x 220 mm; connector 32/64/96-channel DIN 41612

RE332-LF

Multibus II Board; FR4 1,50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE333-LF

Multibus II Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE334-LF

HF-Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); connector 32/64/96-channel DIN 41612

RE430-LF

PCI-Bus Board; FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 2.54 x 2.54 mm

RE434-LF

FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.25 x 1.25 mm; 40 x 60 soldering pads

RE435-LF

FR4 0,80 mm double-sided 35 µm Cu (plated through); 53 x 95 mm; SMD-breadboard 1.27 x 1.27 mm; 39 x 59 soldering pads

RE436-LF

SMD-Mix; FR4 0.80 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm & 2.54 x 2.54 mm; connector 32/64/95-channel DIN 41612

RE437-LF

FR4 1.50 mm double-sided 35 µm Cu (plated through); spacing 1.27 x 1.27 mm; connector 32/64/96-channel DIN 41612

RE438-LF

FR4 1.50 mm double-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 1.27 x 1.27 mm; 8588 soldering pads

RE440-LF

PGA-Board; FR4 1.50 mm double-sided 35 µm Cu; interstitial spacing 2.54 x 2.54 mm; connector 32/64/96-channel DIN 41612

RE450-LF

FR4 1.50 mm single-sided 35 µm Cu; without holes; Europeformat 100 x 160 mm; approx. 40 different QFP-, SOP-, SSOP-, SDIP-casings

RE460

PLCC-, QFP-modules; 120 x 175 mm; adaption circuit board for 23 different SMD-Ics (plated through)

RE460-01

Adaption circuit board for QFP 32, 64 (0.80 mm) and QFP 64 (0.50 mm)

RE460-02

Adaption circuit board for QFP 80 (0.80 mm) and QFP 100 (0.65 mm)

RE460-03

Adaption circuit board for QFP 80,84 (0.65 mm)

RE460-04

Adaption circuit board for QFP 144, 160 (0.65 mm) and QFP 100, 132, 164 (0.635 mm)

RE460-05

Adaption circuit board for PLCC 32, 52, 68, 84 (1.27 mm) and QFP 100 (0.635 mm) and QFP 100 (0.50 mm)

RE460-06

Adaption circuit board for PLCC 28, 44 (1.27 mm) and QFP 44 (0.80 mm)

RE460-07

Adaption circuit board for PLCC 18 (1.27 mm)

RE460-08

Adaption circuit board for PLCC 20 (1.27 mm)

RE460-09

Adaption circuit board for PLCC Eprom 32 (1.27 mm)

RE470

GFP-modules; 132 x 203 mm; adaption circuit board for 23 different SMD-QFPs (plated through)

RE470-01

Adaption circuit board for QFP 40, 48 (0.50 mm) and QFP 80 (0.40 mm)

RE470-02

Adaption circuit board for QFP 80 (0.50 mm) and QFP 100, 108 (0.40 mm)

RE470-03

Adaption circuit board for QFP 120, 128 (0.50 mm) and QFP 100, 108 (0.40 mm)

RE470-04

Adaption circuit board for QFP 72, 100 (0.50 mm) and QFP 12 (0.40 mm)

RE470-05

Adaption circuit board for QFP 144, 176 (0.50 mm) and QFP 184 (0.40 mm)

RE470-06

Adaption circuit board for QFP 256, 264 (0.50 mm) and QFP 224, 232 (0.40 mm)

RE470-07

Adaption circuit board for QFP 208, 240 (0.50 mm) and QFP 264 (0.40 mm)

RE471

Multiadapter QFP 144 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers

RE472

Multiadapter QFP 240 (plated through); surface chem. Au; two universal QFP layouts for various housing sizes and pin numbers

RE500-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes

RE500-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.50 x 2.50 mm; 39 strips with 61 holes

RE510-S1

CEM3 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160mm; spacing 2.54 x 2.54 mm; 38 strips

RE510-S2

CEM3 1.50 mm single-sided 35 µm Cu; 100 x 220 mm; spacing 2.54 x 2.54 mm; 38 strips

RE510-S3

CEM3 1.50 mm single-sided 35 µm Cu; 100 x 580 mm; spacing 2.54 x 2.54 mm; 38 strips

RE512-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

RE512-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

RE520-HP

FR2 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

RE520-HT

P97 1.50 mm single-sided 35 µm Cu; chem. Au; up to 260˚ centigrade

RE520-LF

FR4 1.50 mm single-sided 35 µm Cu; Europeformat 100 x 160 mm; spacing 2.54 x 2.54 mm; 38 strips with 61 holes

RE521-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612

RE521-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 57 holes; connector 32-channel DIN 41612

RE522-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612

RE522-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; connector 31-channel DIN 41612

RE523-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel

RE523-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 strips with 61 holes; direct connector 37-channel

RE524-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612

RE524-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 61 holes; connector 32 -channel DIN 41612

RE525-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612

RE525-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 37 x 57 soldering pads; connector 32-channel DIN 41612

RE526-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612

RE526-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 36 strips with 56 holes; connector H 15 DIN 41612

RE527-HP

FR2 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612

RE527-LF

FR4 1.50 mm single-sided 35 µm Cu; spacing 2.54 x 2.54 mm; 38 strips with 57 holes; connector 32/64/96-channel DIN 41612

RE610-LF

Eurocard for grids 1.00, 2.00 and 2.54 mm

RE620-LF

Eurocard for grids 1.25, 1.27 and 2.54 mm

RE630-LF

Eurocard for grids 3.50, 3.81 and 2,54 mm

RE640-LF

Eurocard for grids 5.00, 5.08 and 2.54 mm

RE650-LF

Eurocard for grids 2.50, 6.35 and 2.54 mm

RE660-LF

Eurocard for grids 7.50, 7.62 and 2.54 mm

RE711001-LF

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 57 different SMD components

RE712001-LF

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 85 different SMD components

RE714001-LF

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; Pick & Place; 4 x QFP 208

RE715001-LF

FR4 1.50 mm single-sided 35 µm Cu; 100 x 140 mm; solder stop mask & additional print: 4 x QFP P=0.40 / 15.7 mil.

RE716001-LF

Solder practice board for SMD

RE840-LF

FR4 1.50 mm single-sided 35 µm Cu; double Europeformat 160 x 233.40 mm; spacing 2.54 x 2.54 mm; connector 32/64/96-pol. DIN 41612

RE899

Adap. SO8/SO8w/HSOP8/HTSOP8/SOP8 P=1.27 mm

RE900

SMD-TSOP I/II Multiadapter; FR4 1.50 mm double-sided 35 µm Cu (plated through); 14 different TSOP I & 7 different TSOP II

RE900-01

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.40 mm, pins 20, 40, 48, 60

RE900-02

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.50 mm, pins 28, 32, 40, 48

RE900-03

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.50 mm, pins 20, 24

RE900-04

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP I, pitch 0.65 mm, pins 16, 24, 28, 36

RE900-05

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP II, pitch 0.80 mm, pins 40, 44

RE900-06

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSOP II, pitch 1.27 mm, pins 20, 24, 26, 28, 32

RE901

SOT 23 SMD Multiadapter; FR4 1.50 mm single-sided 35 µm CU; 22.86 x 46.72 mm

RE902

Adapter SOT 23-10 0.50 mm Pitch HM 2.54 mm

RE903

MSOP-8 (8-leads molded small outline package)

RE904

MSOP-10 (10-leads molded small outline package)

RE904PIN

Adapter MSOP10 P=0.50 mm with pins

RE905

Adapter SMD - components 0805, 0603, 0402 HM 2.54 mm

RE906

Adapter for 5-Pin-SC70, 6-Pin-SC70, 8-Pin-SOT23

RE907

Adapter SOT 23-10 0.95 mm Pitch HM 2.54 mm

RE908

Adapter SOT 89 1.50 mm Pitch HM 2.54 mm

RE909

Adapter SOT 23-3 0.95 mm Pitch HM 2.54 mm

RE910

Adapter SOT 23-6 1.00 mm Pitch HM 2.54 mm

RE910PIN

Adapter SOT23-6 P=0,95 mm with pins

RE911

Adapter SOT 23-8 0.65 mm Pitch HM 2.54 mm

RE912

Adapter SOT223 2.30 mm Pitch HM 2.54 mm

RE913

Adapter DFN10/eMSOP10 0.50 mm Pitch HM 2.54 mm

RE914

Adapter MSOP8 0.65 mm Pitch HM 2.54 mm

RE915

Adapter SC70-6, SC88-6, SOT363 ,0.65 mm Pitch

RE916

Adapter SDIP32 1.778 mm Pitch HM 2.54 & 1.27 mm

RE917

Adapter SDIP64 1.778 mm Pitch HM 1,27 mm

RE918

Adapter Molex FPC/FFC 1.00 & 0.50 mm

RE919

Adapter RS232 RM 2.54 mm Shield Pad

RE920C64/1LF

Short-circuit bridges; connector DIN 41612

RE920C64/2LF

Microswitches; connector DIN 41612

RE931

SSOP-SMD Multiadapter (shrink small outline package); adaption circuit board for 7 different SSOP

RE931-01

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 14, pitch 0.65 mm

RE931-02

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 16, pitch 0.65 mm

RE931-02PIN

Adapter SSOP16 P=0,635 mm with pins

RE931-02ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 16, pitch 0.65 mm; designed in a single row

RE931-03

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 20, pitch 0.65 mm

RE931-04

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 24, pitch 0.65 mm

RE931-05

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 28, pitch 0.65 mm

RE931-05ST

FR4 1.5 mm double-sided 35 µm Cu (plated through); SSOP 28, pitch 0.65 mm; designed in a single row

RE931-06

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 48, pitch 0.635 mm

RE931-07

FR4 1.50 mm double-sided 35 µm Cu (plated through); SSOP 56, pitch 0.635 mm

RE932

SO/ SOJ-SMD Multiadapter (small outline); adaption circuit board for 10 different SOs

RE932-01

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 8, pitch 1.27 mm

RE932-01PIN

Adapter SO8 P=1,27 mm with pins

RE932-01ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 8, pitch 1.27 mm; designed in a single row

RE932-02

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 8w, pitch 1.27 mm

RE932-03

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 14, pitch 1.27 mm

RE932-03ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 14, pitch 1.27 mm; designed in a single row

RE932-04

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16, pitch 1.27 mm

RE932-04PIN

Adapter SO16 P=1,27 mm with pins

RE932-04ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16, pitch 1.27 mm; designed in a single row

RE932-05

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16w, pitch 1.27 mm

RE932-05ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 16w, pitch 1.27 mm; designed in a single row

RE932-06

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 20w, pitch 1.27 mm

RE932-06ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 20w, pitch 1.27 mm; designed in a single row

RE932-07

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 24w, pitch 1.27 mm

RE932-07ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 24w, pitch 1.27 mm; designed in a single row

RE932-08

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 28w, pitch 1.27 mm

RE932-09

FR4 1.50 mm double-sided 35 µm Cu (plated through); SO 32, pitch 1.27 mm

RE932-10

FR4 1.50 mm double-sided 35 µm Cu (plated through); SOJ 40, pitch 1.27 mm

RE933

TSSOP-SMD Multiadapter (thin shrink small outline package); adaption circuit board for 10 differents TSSOP

RE933-01

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 8, pitch 0.65 mm

RE933-01ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 8, pitch 0.65 mm; designed in a single row

RE933-02

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 14, pitch 0.65 mm

RE933-02PIN

Adapter TSSOP14 P=0,65 mm with pins

RE933-02ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 14, pitch 0.65 mm; designed in a single row

RE933-03

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 16, pitch 0.65 mm

RE933-03ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 16, pitch 0.65 mm; designed in a single row

RE933-04

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 20, pitch 0.65 mm

RE933-04ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 20, pitch 0.65 mm; designed in a single row

RE933-05

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 24, pitch 0.65 mm

RE933-06

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 28, pitch 0.65 mm

RE933-06ST

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 28, pitch 0.65 mm; designed in a single row

RE933-07

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 32, pitch 0.65 mm

RE933-08

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 38, pitch 0.50 mm

RE933-09

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 48, pitch 0.50 mm

RE933-10

FR4 1.50 mm double-sided 35 µm Cu (plated through); TSSOP 56, pitch 0.50 mm

RE934-01E

Multiadapter QFP44 & QFN44 P=0.50 mm RM 2.54 mm

RE934-02E

Multiadapter QFP48 & QFN48 P=0.50 mm RM 2.54 mm

RE934-03E

Multiadapter QFP32 & QFN32 P=0.65 mm RM 2.54 mm

RE934-03R

Multiadapter QFP32 & QFN32 P=0.65 mm RM 2.54 mm

RE934-04E

Multiadapter QFP32 & QFN32 P=0.80 mm RM 2.54 mm

RE934-04R

Multiadapter QFP32 & QFN32 P=0.80 mm RM 2.54 mm

RE934-05E

Multiadapter TQFP32 to 100 P=0.50 mm RM 2.54 mm

RE934-06E

Multiadapter TQFP32 to 64 P=0.80 mm RM 2.54 mm

RE934-07E

Multiadapter QFP/TQFP/LQFP80 to 100 P=0.50 mm

RE934-08E

Multiadapter QFP64 & QFN64 P=0,50 mm RM 2,54 mm

RE934-09E

Multiadapter QFP56 & QFN56 P=0.50 mm RM 2.54 mm

RE935-01E

Multiadapter QFP44 & TQFP44 P=0.80 mm RM 2.54 mm

RE935-02E

Multiadapter QFN32 P=0.50mm RM 2.54 mm

RE935-02R

Multiadapter QFN32 P=0.50mm RM 2.54 mm

RE935-03E

Multiadapter QFN40 P=0.50 mm RM 2.54 mm

RE935-03R

Multiadapter QFN40 P=0.50 mm RM 2.54 mm

RE935-04E

Multiadapter QFN20 & LFCSP20 P=0.65 mm

RE935-04R

Multiadapter QFN20 & LFCSP20 P=0.65 mm

RE935-05E

Multiadapter QFN20 P=0.50 mm RM 2.54 mm

RE935-05R

Multiadapter QFN20 P=0.50 mm RM 2.54 mm

RE935-06E

Multiadapter QFN16 P=0.50 mm RM 2.54 mm

RE935-06R

Multiadapter QFN16 P=0.50 mm RM 2.54 mm

RE935-07E

Multiadapter LGA16 P=0.50 mm RM 2.54 mm

RE935-07R

Multiadapter LGA16 P=0.50 mm RM 2.54 mm

RE935-08E

Multiadapter QFN16 P=0.65 mm RM 2.54 mm

RE935-08R

Multiadapter QFN16 P=0.65 mm RM 2.54 mm

RE936-01

Multiadapter SOP32 1.27 mm Pitch HM 2.54 & 1.27 mm

RE936-02

Multiadapter SOP56 & HSOP56 0.80 mm Pitch

RE936-03

Multiadapter TSOP56 & HTSOP56 0.635 mm Pitch

RE936-04

Multiadapter TSOP56 & HTSOP56 0.65 mm Pitch

RE936-05

Multiadapter TSOP56 & HTSOP56 0.50 mm Pitch

RE936-06

Multiadapter SSOP28 & TSSOP28 0.65 mm Pitch

RE936-07

Adap. SOP28/SOIC28/SOIC28w/HSOP28/SO28 P=1.27

RE936-08

Multiadapter TSSOP24 / SSOP24 0.65 mm Pitch

RE936-09

Multiadapter SOP24, HSOP24, SOIC24, SO24 P=1.27

RE937-01

Multiadapter 8 Pin DIP to DIP

RE937-02

Multiadapter 14 Pin DIP to DIP

RE937-03

Multiadapter 16 Pin DIP to DIP

RE937-04

Multiadapter 28 Pin DIP to DIP

RE937-05

Multiadapter 40 Pin DIP to DIP

RE937-06

Adapter WLCSP4 0.40 mm Pitch RM 2.54 mm

RE937-07

Adapter WLCSP6 0.50 mm Pitch RM 2.54 mm

RE938-01

Adapter HSSOP8 P=0.80 mm HM 2.54 mm

RE938-03

Adapter HSSOP16 P=0.80 mm HM 2.54 mm

RE938-05

Adapter HSSOP24 P=0.80 mm HM 2.54 mm

RE938-06

Adapter HSSOP28 P=0.65 mm HM 2.54 mm

RE938-09

Adapter HSSOP48 P=0.65 mm HM 2.54 mm

RE938-10

Adapter HSSOP56 P=0.50 mm HM 2.54 mm

RE941-S1

Solderable Bread Board 8-Pin-Socket 31.75 x 17.14 mm

RE941-S2

Solderable Bread Board 8-Pin-Socket 46.99 x 17.14 mm

RE941-S3

Solderable Bread Board 8-Pin-Socket 46.99 x 47.62 mm

RE942-S1

Solderable Bread Board 14-Pin-Socket 31.75 x 24.76 mm

RE942-S2

Solderable Bread Board 14-Pin-Socket 46.99 x 24.76 mm

RE942-S3

Solderable Bread Board 14-Pin-Socket 46.99 x 55.24 mm

RE943-S1

Solderable Bread Board 16-Pin-Socket 31.75 x 27.30 mm

RE943-S2

Solderable Bread Board 16-Pin-Socket 46.99 x 27.30 mm

RE943-S3

Solderable Bread Board 16-Pin-Socket 46.99 x 57.78 mm

RE944-S1

Solderable Bread Board 28-Pin-Socket 31.75 x 42.54 mm

RE944-S2

Solderable Bread Board 28-Pin-Socket 46.99 x 42.54 mm

RE944-S3

Solderable Bread Board 28-Pin-Socket 46.99 x 73.02 mm

RE945-S1

Solderable Bread Board 40-Pin-Socket 31.37 x 57.78 mm

RE945-S2

Solderable Bread Board 40-Pin-Socket 54.67 x 57.78 mm

RE945-S3

Solderable Bread Board 40-Pin-Socket 54.61 x 88.26 mm

RE965-01PIN

Adapter SO18 P=1,27 mm with pins

RE965-02PIN

Adapter DPAK3 P=4,70 mm with pins

RE965-03PIN

Adapter SC70 P=0,65 mm with pins

RE965-04

Adapter QFN24 P=0.50 mm HM 2.54 mm

RE965-07E

Adapter QFN32 P=0.65 mm HM 2.54 mm

RE965-08PIN

Adapter QFN52 P=0,40 mm with pins

RE965-09

Multiadapter QFP52 & TQFP52 P=1.00 mm HM 2.54 mm

RE965-10

Multiadapter QFN56 P=0.40 mm HM 2.54 mm

RE966-01E

Adapter QFP64 P=0.80 mm HM 2:54 mm

RE966-03E

Adapter QFP80 P=0.80 mm HM 2.54 mm

RE968-01

Adapter HSOP24 P=1.00 mm HM 2.54 mm

RE969-01

Adapter TSOP56 P=0.635 mm HM 2.54 mm

RE969-02

Adapter TSOP56 P=0.65 mm HM 2.54 mm

RE969-03PIN

Adapter SSOP8 P=0,65 mm with pins

RE969-04PIN

Adapter SOP5 P=1,27 mm with pins

RE969-05PIN

Adapter SOP4 P=2,54 mm with pins

RE969-06PIN

Adapter TSOP5 P=0,95 mm with pins

RE969-07PIN

Adapter SOT353 P=0,65 mm with pins

RE969-08PIN

Adapter DFN12 P=0,45 mm with pins

RE969-09PIN

Adapter QFN10 P=0,50 mm with pins

page 1 of 1

Roth Elektronik Produkte

  • FR4-Platinen in verschiedenen Stärken und mit unterschiedlichen Kupferbeschichtungen, sowohl einseitig als auch zweiseitig.
  • FR2-Platinen ohne Kupferbeschichtung mit standardisierten Rastern für vielseitige Anwendungen.
  • CEM3-Platinen mit verbesserter Temperaturbeständigkeit und Stabilität, ideal für Anwendungen mit höheren thermischen Anforderungen.
  • Diverse Laborkarten in unterschiedlichen Größen und Rastermaßen, geeignet für spezifische experimentelle und Entwicklungszwecke.
  • Platinen im Europaformat mit unterschiedlichen Kupferstärken, Rastern und Steckverbindern, konform zu DIN 41612.
  • Spezielle Adaptacks-Basisplatinen und selbstklebende Kontaktleisten in verschiedenen Pitch-Größen für benutzerdefinierte Anwendungen.
  • Diese Produkte werden gemäß aktuellen RoHS- und REACH-Vorschriften von ISO-zertifizierten Produktionspartnern nach UL-Norm gefertigt, was ihre Qualität und Zuverlässigkeit gewährleistet. Roth Elektronik setzt somit neue Standards in der Entwicklung und Herstellung von Prototypenplatinen, die eine breite Palette von Anwendungen in der Elektronikindustrie abdecken.
Roth Elektronik prototyping cards are manufactured according to the current RoHS and REACH specifications of ISO-certified production partners in compliance with the UL norm.